免清洗助焊膏是随电子工业发展及环境保护的需要而产生的一种新型焊膏。它在解决不使用CFC类清洗溶剂减少环境污染方面和解决因细间隙、高密度元器件组装带来的清洗困难和元器件与清洗剂之间的相容问题方面具有重要的意义。
No clean solder paste help is a new type of solder paste produced with the need of electronic industry development and environmental protection. It resolve not to use CFC type cleaning solvent to reduce environmental pollution and it is important significance to solve for fine gap, high density of components assembled the cleaning difficulties and components and cleaning agent compatibility problems.
从90年代初开始，免清洗助焊膏在电子工业领域里的电子元器件与印制板的焊接生产中广泛应用。但是，随着高密度、轻量化、微型化、高性能化的电子产品应用范围日益扩大，应用环境日益复杂，对产品的可靠性要求越来越高，相应地对于免清洗助焊膏在可靠性方面提出了更高的要求。
From the beginning of the 1990s, cleaning free solder paste help in the field of electronics industry of electronic components and printed circuit board welding is widely used in production. But with the increasingly expanding the scope of application of high density, lightweight, miniaturization and high performance of electronic products, application environment becomes more and more complex, increasing demands on the reliability of the product, accordingly for cleaning free soldering paste in terms of reliability put forward higher requirements.
作为免清洗助焊膏必须具备以下几个条件：
As no clean solder paste must have the following conditions:
1、焊后残留物最少；
2、焊后残留物在温度、湿度下保持惰性且无腐蚀；
3、焊后残留物应有高的绝缘电阻值。
1、minimum residue after welding;
2、after the welding residue in temperature, humidity remain inert and no corrosion;
3、after welding residue should have a high value of insulation resistance.
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